A Microcontact-Printed Nickel-Passivated Copper Grid Electrode for Perovskite Photovoltaics

We report a novel transparent copper-based grid electrode fabricated by microcontact printing that offers high stability toward oxidation in air. Passivation is achieved using 2.5 nm thick layer of nickel buried just below the surface copper film from which etched. This approach to passivation retains advantages associated with lithography for fabrication very fast resist deposition and compatibility low cost, toxicity etchant ammonium persulfate. The processes patterned metal etching complete within less than 1 min. Using this approach, far-field transparency 82% across wavelength range 300–900 sheet resistance 6.8 Ω sq−1 demonstrated, shown be promising alternative indium-tin oxide as perovskite photovoltaic devices.